Fabrication of Au Microstructure Using ICP-RIE

Anisotropic Dry Etching ( RIE ) for Micro and Nanogap Fabrication

The main objective of this research is to develop a micro and nanogap structure using dry anisotropic etching –Reactive Ion EtchingRIE. Amorphous silicon material is used in the micro and nanogap structure and gold as electrode. The fabrication processes of the micro and nanostructure are based on conventional photolithography, wet etching for the Al pattern and wet etching for a-Si pattern usi...

Low sidewall damage plasma etching using ICP-RIE with HBr chemistry of Si=SiGe resonant interband tunnel diodes

The effect and influence of dry plasma etching processes of Si=SiGe using HBr for the formation of diode mesa structures has been investigated to minimise sidewall leakage current. To characterise sidewall damage electrically, Si-based resonant interband tunnel diodes (RITD) were processed and the completed RITDs compared by their peak-to-valley current ratio (PVCR) and valley current density (...

Microstructure of nanostructured amorphous Si-Au-alloys

Controllable microstructure of Au nanoparticle-DNA oligonucleotide conjugates

The Au nanoparticle (AuNPs) and DNA oligonucleotide conjugates will have complicated microstructures because one AuNP can be conjugated to more than one single-stranded DNA (ssDNA) on its surface. In this paper, the AuNPs-DNA conjugates with controllable microstructure were prepared on SiO2 microsphere carriers. The reactions between AuNPs with ssDNA on SiO2 carriers were sterically restricted ...

Au Microstructure and the Functional Properties of Ni/Au Finishes On Ceramic IC Packages

Ni/Au plated finishes used on thick-film metallized multilayer ceramic packages for integrated circuits must meet functional requirements such as bondability, sealability, and solderability. Their ability to do so is dependent, among other things, upon the ability of the Au deposit to inhibit the grain boundary diffusion and subsequent surface oxidation of Ni. In this study, the relationship be...